34 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick minimum mounting area for compact devices. minimized mounting area prevents negation of size advantage of the card. ? features for mobile phones, personal digital assistants, digital still cameras, compact audio equipment ? applications memory stick micro standard mount surface mounting type push-push type 250v ac 1minute applicable media structure items specifications media ejection structure mounting type mounting style 25 ? to 60 ? 1,000m
min. 40m
max. 12,000cycles operating temperature range performance contact resistance initial insertion and removal cycle voltage proof insulation resistance initial typical specifications standard mount media ejection structure push-push type mounting system stand-off mm 0 product no. SCNA1A0300 packing system taping product line connector for memory stick micro scna series
35 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module connector for memory stick micro scna series
g 1 (16.9) 15 14.9 1.8 13.95 0.75 1 0.3 0.9 g 10=9 0.9 p 3.12 0.8 0.9 0.41 2.8 4.4 2.01 1.1 0.75 1 1 0.75 12.05 13.95 0.33 card eject travel (4) over travel (1) card center connector center dimensions pc board mounting hole dimensions viewed from the mounting face side unit:mm style
50 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick soldering conditions example of reflow soldering condition reference 1. heating method: double heating method with infrared heater. 2. temperature measurement: thermocouple 0.1 to 0.2 ca k or cc t . 3. temperature profile surface of products 200 100 240 ? (max.) 230 ? (min.) 150 ? 180 ? time (s) 10 sec.(max.) 90 ? 30 sec. room temperature temperature (?c ) pre-heating heating time sec. 1. when soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. caution is therefore required. 2. avoid use of water-soluble soldering flux, since it may corrode the product. 3. check and conform to reflow soldering requirements under actual mass production conditions. 4. pc board warping may alter the characteristics. please take this into consideration when designing patterns and layout. 5. the card specifications are provided by the above manufactures. products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. cautions for using this product small memory card connectors
|
